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Harris® SCPF4POP

Harris® Stay-Clean® SCPF4POP Soldering Flux, 4 oz, Brush Cap Bottle, Pas

Harris® SCPF4POP

Designed primarily for copper to copper and copper to brass connections the paste form is ideal for soldering tube joints. Not recommended for electrical or electronic applications due to the potential corrosive residue of the flux. Stay-Clean® Paste flux works well with most leaded and lead-free solder compositions. Flux residue should be removed after soldering.

Harris® Stay-Clean® Soldering Flux, Series: SCPF4, 4 oz Net Content, Brush Cap Bottle Container, Paste Form, 1.11 Specific Gravity, Up to 700 deg F, Brass, Bronze, Copper, Monel®, Most Metals and Steel Cut Materials

Net Content      :      4 oz
Specific Gravity      :      1.11
Temperature Rating      :      Up to 700 deg F
Cut Materials      :      Brass, Bronze, Copper, Monel®, Most Metals and Steel
  • pdf Catalog https://assets.unilogcorp.com/267/ITEM/DOC/Harris_4300672_Catalog.pdf
  • pdf Service Manual https://assets.unilogcorp.com/267/ITEM/DOC/Harris_D620FMPOP_Service_Manual.pdf
  • pdf Specification Sheet https://assets.unilogcorp.com/267/ITEM/DOC/Harris_SCPF4POP_Specification_Sheet.pdf