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Harris® SCPF4POP
Designed primarily for copper to copper and copper to brass connections the paste form is ideal for soldering tube joints. Not recommended for electrical or electronic applications due to the potential corrosive residue of the flux. Stay-Clean® Paste flux works well with most leaded and lead-free solder compositions. Flux residue should be removed after soldering.
Harris® Soldering Flux, SCPF4 Series, 4 oz Net Content, Brush Cap Bottle Container, Paste Form, 1.11 Specific Gravity, Up to 700 deg F, Cut Materials: Brass, Bronze, Copper, Monel®, Most Metals, Steel
| Series | : | SCPF4 Series |
| Container Type | : | Brush Cap Bottle |
| Temperature Rating | : | Up to 700 deg F |
| Net Content | : | 4 oz |
| Form | : | Paste |
| Specific Gravity | : | 1.11 |
| Cut Materials | : | Brass, Bronze, Copper, Monel®, Most Metals, Steel |
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